Power chips are connected to exterior circuits through packaging, and their efficiency depends upon the support of the product packaging. In high-power situations, power chips are normally packaged as power modules. Chip interconnection describes the electric link on the top surface area of the chip, which is usually light weight aluminum bonding cable in conventional components. ^
Traditional power component bundle cross-section
Presently, business silicon carbide power modules still mostly utilize the packaging technology of this wire-bonded standard silicon IGBT module. They deal with issues such as big high-frequency parasitic specifications, inadequate warmth dissipation ability, low-temperature resistance, and not enough insulation stamina, which limit the use of silicon carbide semiconductors. The display of excellent performance. In order to resolve these issues and fully make use of the huge prospective benefits of silicon carbide chips, lots of new packaging innovations and services for silicon carbide power modules have actually emerged recently.
Silicon carbide power component bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have established from gold cord bonding in 2001 to aluminum cable (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have developed from gold wires to copper wires, and the driving pressure is cost decrease; high-power tools have established from light weight aluminum wires (strips) to Cu Clips, and the driving force is to improve product performance. The higher the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a strong copper bridge soldered to solder to attach chips and pins. Compared to standard bonding packaging approaches, Cu Clip modern technology has the complying with advantages:
1. The connection in between the chip and the pins is made of copper sheets, which, to a certain extent, replaces the basic wire bonding method between the chip and the pins. Consequently, an one-of-a-kind bundle resistance value, greater current circulation, and much better thermal conductivity can be obtained.
2. The lead pin welding area does not require to be silver-plated, which can fully conserve the cost of silver plating and inadequate silver plating.
3. The item look is entirely constant with typical items and is mostly made use of in web servers, portable computer systems, batteries/drives, graphics cards, electric motors, power supplies, and various other areas.
Cu Clip has two bonding methods.
All copper sheet bonding technique
Both eviction pad and the Resource pad are clip-based. This bonding method is much more expensive and intricate, yet it can achieve far better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus cord bonding approach
The source pad makes use of a Clip approach, and eviction makes use of a Wire approach. This bonding method is somewhat less expensive than the all-copper bonding method, saving wafer location (appropriate to very little entrance areas). The process is simpler than the all-copper bonding method and can get much better Rdson and far better thermal result.
Provider of Copper Strip
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